HERMITICITY OF ELECTRONIC PACKAGES PDF

Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.

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It provides mechanical and chemical protection of delicate components. Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate.

Pl can be post-processed to provide conductive surfaces. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge.

Electronic packaging

It is also commonly used in high voltage products to allow live parts to be placed closer together, so that the product can be smaller. Today it is most widely used to protect semiconductor components from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together. This industry developed the glass-seal electrical feedthrough, using alloys such as Kovar to match the coefficient of expansion of the sealing glass so as to minimize mechanical stress on the critical metal-glass bond as the tube warmed up.

After the vacuum is released, the fluid flows into the part. Packaging for aerospace, marine, or military systems imposes different types of design criteria. Formally called “encapsulation”, potting electtronic of immersing the part or assembly in a liquid resin, then curing it.

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Quantities tend to be small; sometimes only one unit of a custom design is required. It can be very economical, but somewhat difficult to achieve consistent process quality. These requirements extend beyond and interact with the electrical design.

Six Sigma: Hermeticity Testing

Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection molding, die casting, investment casting, and so on. Potting can be done in a pre-molded potting shell, or directly in a mold. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made for prototypes and small production runs with little custom tooling expense.

Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids.

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Electronic packaging Integrated circuit packaging List of integrated circuit packaging types Printed hemriticity board Surface-mount technology Through-hole technology. The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation.

Gasketed metal castings are sometimes used to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water.

Electronic packaging is a major discipline within the field of mechanical engineering.

In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal.

Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation.

Industrial design Packaging Packaging microfabrication Chip carriers. Potting can be rigid or soft. They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex hermjticity shapes, in combination with hermetically sealed housings.

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Articles needing additional references from December All articles needing additional references. Please help improve this article by adding citations to reliable ppackages.

Today, glass-seal packages are used mostly in critical components and assemblies for aerospace use, where leakage must be prevented even under extreme changes in temperature, pressure, and humidity. This article needs additional citations for verification. In some products, such as computer accessory boards, they’re all the structure there is. December Learn how and when to remove elsctronic template message. Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes.

Electronic packaging – Wikipedia

Unsourced material may be challenged and removed. Examples are injection molding, transfer molding, vacuum forming, and die cutting. The pressure above the fluid is lowered to a full vacuum. Parts are submerged in a polymerizable monomer or solvent-based low viscosity plastic solution. Printed circuits are primarily a technology for connecting components together, but they also provide mechanical structure. This page was last edited on 31 Decemberat High-reliability equipment often must survive drop tests, loose cargo vibration, secured cargo vibration, extreme temperatures, humidity, water immersion or spray, rain, sunlight UV, IR and visible lightsalt spray, explosive shock, and many more.

This makes them part of the universe of electronic packaging. This also excludes dirt and conductive contaminants such as impure water from sensitive areas. Views Read Edit View history.

Atmospheric pressure collapses the voids and forces the liquid resin into all internal spaces.